![]() Floor
专利摘要:
A heatable and vertically adjustable floor comprises a load-bearing floor slab (3) which is disposed at a distance (2) above a subfloor (1) and which by means of levelling devices (6) is vertically adjustable in relation thereto. The floor has heat-emitting conduits (18) disposed under an upper floor coating (5), and an insulating layer. According to the present invention, the insulating layer (4) is disposed above the floor slab (3) and the conduits (18) are countersunk in grooves (17) in the upper side of the insulating layer (4). Heat-disseminating plates of aluminium are located in the grooves (17) partly around the conduits (18) and on both sides of the grooves above the insulating layer (4). 公开号:SE1000240A1 申请号:SE1000240 申请日:2010-03-16 公开日:2011-09-17 发明作者:Goeran Carlsson 申请人:Hertig Knut Ab; IPC主号:
专利说明:
The conduits cannot be freely selected depending on heating requirements, such as smaller grooves at outer walls under windows. PROBLEM STATEMENT The object of the present invention is to design the initially indicated floor construction in such a way that the disadvantages of older, prior art are eliminated. In particular, the object of the invention is to design the floor construction in such a way that it becomes more economical in manufacture, that the grooves for the heat-carrying pipes can be placed at selectable C-C distances and that in addition the leveling devices can be placed freely as required. TROUBLESHOOTING The object underlying the invention is achieved if the initially indicated floor is characterized in that the insulating layer is arranged on the upper side of the load-bearing floorboard and that the heat-emitting cables are arranged recessed in grooves in the upper side of the insulating layer. PREFERRED EMBODIMENT The invention will now be described in more detail with reference to the accompanying drawing, which shows a vertical section through a floor according to the invention. In the attached drawing, although this is a section, chafing has been omitted to make the drawing easier to read. In Fig. 1, the reference numeral 1 refers to a subfloor, the reference numeral 2 a space, the reference numeral 3 a load-bearing floorboard, the reference numeral 4 an insulating layer and the reference numeral 5 an upper floor covering. The floor construction is supported in its entirety by height-adjustable leveling devices 6, which comprise an externally threaded, preferably plastic-made and hollow screw 7, which has threaded engagement with a surrounding bushing 8. By rotating the screw 7 in the bushing 8 3, the height of the bushing is adjustable relative to the subfloor 1. In order for this to be possible, the screw 7, which is tubular, has a much greater length at the time of mounting than shown in the figure and extends up over the top of the insulation layer 4 engaging means for transmitting a rotational movement. At its lower end, the screw 7 has a bottom 9 with a central opening 10, through which a fastening element 15 is passed and fastened in the subfloor 1. The drawing shows that the bushing 8 along its lower periphery has a radially projecting. End 11, on which the supporting floorboard 3 rests. The bushing 8 is slotted in the axial direction and has barbs or projections 12 along its upper periphery, which, when the bushing 8 is pressed through an opening in the load-bearing floorboard 3, are pushed radially inwards to snap out in the chamfers 13 which are found at the top of the load-bearing floorboard 3. The fit between the bushing 8 and the opening in the load-bearing floorboard and the suspension force are adjusted in such a way that the bushing 8 should not rotate in the opening in the floorboard when the screw 7 is rotated. The drawing further shows that the insulating layer, which may consist of an expanded plastic, has an opening 14, through which the screw 7 is cut down to threaded engagement with the bushing 8 when mounting the screw. After height adjustment and fastening of the fastening member 15 through the hollow interior of the screw 7, the screw 7 is cut, for example as shown at line 16. The insulation layer 4 is glued to the top of the load-bearing floorboard 3 and can be delivered to a construction site in this condition. According to the invention, the insulating layer 4 has on its upper side grooves 17 for receiving heat-emitting pipes 18, for example plastic hoses or pipes for the supply of hot water or other heat-carrying medium. Partially enclosing and in as good contact as possible with the conduits 18 are heat-conducting and heat-dissipating plates 19, preferably of aluminum. The fit between the grooves 17, the plates 19 and the conduits 18 is such that surface contact occurs and in addition a certain pressure pressure so that good heat transfer takes place between the conduits 18 and the heat dissipating plates 19. 4 The heat dissipating plates 19 have upper portions which lie on the top of the insole the ring layer 4, preferably on both sides of a groove 17. The extent of the width of the heat-conducting plates 19 depends on how close the conduits 18 are to each other, but a width of the order of 4-8 cm on each side of a groove 17 can be purposeful. The portions of the heat-dissipating plates 19 which lie on the upper side of the insulating layer 4 are relatively thin and do not prevent a good connection of the overlying floor covering 5. Gluing and / or filling may be suitable. Since the load-bearing floorboard 3 has no grooves in the form of milled grooves, its thickness can be kept at a limited value in the order of 19-24 mm, preferably 22 mm. The absence of weakening grooves in the load-bearing floorboard 3 also means that the leveling devices 6 can have an arbitrary placement without affecting the strength. Thus, according to the invention, it is possible to place the leveling devices 6 differently close depending on, for example, how the subfloor 1 is shaped. Since the load-bearing floorboard 3 is stable and immovable, the insulating layer 4 does not have to absorb any loads other than purely vertical pressure cracks. For this reason, cheaper material qualities can be used and furthermore the portions of the insulating layer 4 which settle under a groove are fully supported by the load-bearing floorboard 3. There are therefore no strength problems in connection with the grooves 17. The lines 18 and the leveling devices 6 can thus be placed completely independently of each other, where the location of the lines can be completely dictated by thermal engineering considerations, while the location of the leveling devices can be dictated by the nature of the subfloor and strength aspects. Since the insulating layer 4 is located on the upper side of the load-bearing floorboard 3, one could possibly fear problems caused by high relative humidity on the floorboard 3. However, in practice this is not a risk factor if the floorboard is chosen from a moisture-proof or moisture-resistant type.
权利要求:
Claims (5) [1] Heatingable, height-adjustable floor comprising an adjustable supporting floor slab (3) arranged above a subfloor (1) and by means of leveling devices (6), heat-dissipating pipes (18) arranged under a floor covering (5), and an insulating layer (4) , characterized in that the insulating layer (4) is arranged on the upper side of the supporting floorboard (3) and that the heat-emitting conduits (18) are arranged immersed in grooves (17) in the upper side of the insulating layer. [2] Floor according to claim 1, characterized in that heat-dissipating plates (19) are arranged in and along a groove (17), which have portions which lie on the upper side of the insulating layer (4) in connection with one or both sides. of a track. [3] Floor according to Claim 1 or 2, characterized in that the position of the leveling devices (6) is selectable independently of the position of the grooves (17). [4] Floor according to one of Claims 1 to 3, characterized in that the leveling means (6) comprise an internally threaded bushing (8) fastened to the supporting floorboard (3), the upper end of which is level with or below the supporting board. top, and a tubular screw (7) cooperating with the bushing, that the insulating layer has a through-opening (14) for passing the screw into cooperation with the bushing. [5] Floor according to one of Claims 1 to 4, characterized in that the load-bearing floorboard (3) and the insulating layer (4) are joined to form a continuous unit before laying the floor.
类似技术:
公开号 | 公开日 | 专利标题 US11041638B2|2021-06-22|Method and apparatus for positioning heating elements US9127446B2|2015-09-08|Floor drain US9328520B1|2016-05-03|High strength in-floor decoupling membrane US20160192443A1|2016-06-30|Support structure for electric cables of a surface heater KR100804825B1|2008-02-20|Construction method using dry type wall for bathroom SE1000240A1|2011-09-17|Floor US20140352815A1|2014-12-04|Channel Drain With Integral Weep Path WO2011119689A3|2012-11-22|In-wall hydronic thermal control system and installation method KR101661421B1|2016-09-29|The bottom panel support memebers and underground parking floor drain system using the same EP2617908B1|2018-07-11|Device for height adjustment of a shower drain or a gutter US9732779B2|2017-08-15|System for mounting heating panels on to wall without drilling holes on the wall CA2906554C|2021-02-16|Support structure for electric cables of a surface heater SE536212C2|2013-07-02|Device at an embedding box for a cavity floor layer GB2548319A|2017-09-20|Temperature control system SE1651413A1|2018-04-24|A floor support structure WO2010034498A3|2010-06-24|Device for controlling the climate of a room with two independent fluid circuits CN105402842A|2016-03-16|Electrode humidifier assembly and combined air-conditioning unit with same CN102414382A|2012-04-11|Apparatus and method for casting concrete wall elements SE528320C2|2006-10-17|Arrangement is for production of heat in floor comprising floor plates with tracks running on floor plate upper sides from one plate edge to that opposite GB2474067A|2011-04-06|Floor board or panel with heating duct embedded in top surface GB2463331A|2010-03-17|Wet area floor former system WO2009111358A3|2009-12-03|Apparatus for installation of electrical floor boxes JP4434257B2|2010-03-17|Floor surface temporary installation device SE536214C2|2013-07-02|Casting box for cavity floor joists and method for mounting one SE1950048A1|2020-07-17|Glue flange and a connection procedure for a wet room floor
同族专利:
公开号 | 公开日 DK2369093T3|2018-08-06| EP2369093A2|2011-09-28| SE536531C2|2014-02-04| EP2369093A3|2012-06-20| ES2676650T3|2018-07-23| EP2369093B1|2018-05-02| PL2369093T3|2018-10-31|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 DE3137410C1|1981-09-19|1986-06-19|MERO-Werke Dr.-Ing. Max Mengeringhausen, GmbH & Co, 8700 Würzburg|Raised floor| JPH0283943U|1988-12-15|1990-06-28| JPH09291692A|1996-04-25|1997-11-11|Central Glass Co Ltd|Floor heating system| AT7025U1|2003-02-17|2004-07-26|Austroflex Gmbh Rohr Isoliersy|HEATER| DE10361336A1|2003-12-18|2005-07-14|Kälberer, Stefan|Heating device for floors| SE528761C2|2004-03-05|2007-02-13|Hertig Knut Ab|Device for removing loose bored material| SE528320C2|2004-12-22|2006-10-17|Hertig Knut Ab|Arrangement is for production of heat in floor comprising floor plates with tracks running on floor plate upper sides from one plate edge to that opposite| KR20090006257U|2007-12-20|2009-06-24|한국스마트플로어|The bottom structure for floor|
法律状态:
优先权:
[返回顶部]
申请号 | 申请日 | 专利标题 SE1000240A|SE536531C2|2010-03-16|2010-03-16|Heating and height adjustable floor|SE1000240A| SE536531C2|2010-03-16|2010-03-16|Heating and height adjustable floor| DK11002095.5T| DK2369093T3|2010-03-16|2011-03-14|Floors that can be heated and height-adjusted| PL11002095T| PL2369093T3|2010-03-16|2011-03-14|Heatable and vertically adjustable floor| ES11002095.5T| ES2676650T3|2010-03-16|2011-03-14|Radiant and vertically adjustable floor| EP11002095.5A| EP2369093B1|2010-03-16|2011-03-14|Heatable and vertically adjustable floor| 相关专利
Sulfonates, polymers, resist compositions and patterning process
Washing machine
Washing machine
Device for fixture finishing and tension adjusting of membrane
Structure for Equipping Band in a Plane Cathode Ray Tube
Process for preparation of 7 alpha-carboxyl 9, 11-epoxy steroids and intermediates useful therein an
国家/地区
|